F-01 is a single-crystal aluminum nitride thermal filler powder with a D50 of approximately 1μm. It offers high thermal conductivity, excellent electrical insulation, and a coefficient of thermal expansion (CTE) that closely matches semiconductor materials such as SiC and GaN. As a single-crystal aluminum nitride thermal filler powder, F-01 provides high purity and fewer grain boundary defects, making it suitable for thermal management applications that demand high material quality and reliability. With its combination of high thermal conductivity and electrical insulation, it serves as an AlN high thermal conductivity insulating filler for advanced electronic systems.
In particle size distribution design for composite materials, the 1μm fine powder plays a key role in "filling the gaps between coarse particles." When combined with larger particle size fillers, it effectively increases packing density and particle-to-particle contact points, thereby further enhancing the overall thermal conductivity of the composite.
