Aluminum nitride, with its excellent thermal conductivity, can replace traditional aluminum oxide and beryllium oxide, making it an ideal choice for substrate materials in large-scale integrated circuits. Furthermore, it is highly suitable for high-density packaging applications, such as VLSI compon...
With the rapid advancement of microelectronics technology, there is an increasingly urgent market demand for ceramic components that offer high thermal conductivity, miniaturization, and complex shapes. While the traditional tape casting process is efficient and yields stable products, it often fall...
Among the various forming processes for aluminum nitride (AlN) ceramics, traditional methods such as die pressing, hot pressing, and isostatic pressing are well-established but face several challenges. Due to the strong hydrophilicity of AlN powder, contact with water should be minimized during the...
In the semiconductor manufacturing industry, temperature control is a critical factor determining product yield. Processes such as thin film deposition and etching require precise temperature control for wafers, where temperature uniformity directly influences chip performance and reliability. Withi...
In the pursuit of miniaturized and high-performance electronic devices, thermal pads serve as silent guardians. They fill gaps, establish efficient heat conduction channels, and shoulder multiple responsibilities including insulation, shock absorption, and sealing. However, the often-unavoidable agi...
