Application of AlN in the Semiconductor Industry : Semiconductor Equipment Components

In semiconductor manufacturing, heat dissipation of silicon wafers is critical. Failure to maintain uniform temperature across the silicon wafer surface will compromise processing uniformity and precision during wafer fabrication.

The advantages of using aluminum nitride as the primary material include: By controlling its volume resistivity, a wide temperature range and sufficient adsorption force can be achieved. Electrostatic chucks (ESC) made of aluminum nitride enable excellent temperature uniformity through highly flexible heater designs. Aluminum nitride components(AlN components) are fabricated via monolithic co-firing, eliminating aging effects caused by electrode degradation and maximizing product quality assurance. They can operate durably in plasma halogen vacuum atmospheres, withstand the harshest processing environments in semiconductor and microelectronics manufacturing, while delivering stable adsorption force and precise temperature control.

Currently, Xiamen Juci uses the carbothermal reduction method to produce aluminum nitride powder, with a production capacity of 700 tons per year at the Xiamen factory and 1200 tons per year at the Inner Mongolia factory.

Contact:

Xiamen Juci Technology Co., Ltd.

Phone: +86 151 5177 8700

Email: qinxianhui@chinajuci.com

Website: www.jucialnglobal.com